Test of ITk 3D sensor pre-production modules with ITkPixV1.1 chip
2023 | journal article. A publication with affiliation to the University of Göttingen.
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Test of ITk 3D sensor pre-production modules with ITkPixV1.1 chip
Calderini, G.; Crescioli, F.; Dalla Betta, G.-F.; Gariano, G.; Gemme, C.; Guescini, F. & Hadzic, S. et al. (2023)
Journal of Instrumentation, 18(01) art. C01010. DOI: https://doi.org/10.1088/1748-0221/18/01/C01010
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Details
- Authors
- Calderini, G.; Crescioli, F.; Dalla Betta, G.-F.; Gariano, G.; Gemme, C.; Guescini, F.; Hadzic, S.; Heim, T.; Lapertosa, A.; Ravera, S.; Ye, H.
- Abstract
- Abstract ITk detector, the new ATLAS tracking system at High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be either 25 × 100 μm 2 (barrel) or 50 × 50 μm 2 (endcap), with one read-out electrode at the centre of a pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50 × 50 μm 2 ) produced by FBK have been bump bonded to ITkPixV1.1 chips at IZM. Bare modules have been assembled in Genoa on Single Chip Cards and characterized in laboratory and on beam.
- Issue Date
- 2023
- Journal
- Journal of Instrumentation
- eISSN
- 1748-0221
