Investigations on the Drying Behaviour of Adhesives on Plasma-Treated Wood Materials

Abstract

In this study, the drying behaviour of a polyvinyl acetate (PVAc) adhesive and an emulsion polymer isocyanate adhesive on particle board and heat-treated beech wood in untreated and plasma-treated (by a dielectric barrier discharge at standard atmospheric pressure) state was investigated. Shear strength tests were performed to monitor the increase in bonding strength during the drying process. The results show an accelerated increase in bonding strength of PVAc-glued particle boards after plasma treatment, but no change in the drying characteristics of heat-treated beech wood was found.