Microstructural analysis of the modifications in substrate-bound silicon-rich silicon oxide induced by continuous wave laser irradiation

2017 | journal article. A publication with affiliation to the University of Göttingen.

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​Microstructural analysis of the modifications in substrate-bound silicon-rich silicon oxide induced by continuous wave laser irradiation​
Wang, N.; Fricke-Begemann, T.; Peretzki, P.; Thiel, K.; Ihlemann, J. & Seibt, M.​ (2017) 
Journal of Alloys and Compounds707 pp. 227​-232​.​ DOI: https://doi.org/10.1016/j.jallcom.2016.12.115 

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Authors
Wang, N.; Fricke-Begemann, Thomas; Peretzki, Patrick; Thiel, Karsten; Ihlemann, Juergen; Seibt, Michael
Abstract
Laser-irradiation of silicon-rich silicon oxides (SRSO) is a promising technique for spatially well-defined production of silicon nanocrystals (nc-Si) showing room temperature photoluminescence. In this work, we use continuous-wave (CW) laser processing to generate nc-Si in SRSO films on fused silica substrates. One main problem is damage introduced by laser processing which results in a porous layer beneath the original film surface as is consistently shown by electron tomography and energy-dispersive X-ray spectrometry. Processing conditions for damage-free nc-Si formation are identified by systematic variation of laser intensity and measuring the depth of the damaged region by transmission electron microscopy (TEM). By combining TEM imaging and analysis it is shown that the damaged region has a composition close to SiO2 which is due to a predominant loss of silicon rather than an a result of surface oxidation during laser processing. (C) 2016 Elsevier B.V. All rights reserved.
Issue Date
2017
Status
published
Publisher
Elsevier Science Sa
Journal
Journal of Alloys and Compounds 
ISSN
1873-4669; 0925-8388

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